#1
29th April 2015, 02:59 PM
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CUSAT M Tech VLSI Syllabus
My sister lost her syllabus of the M.tech course. She is studying at CUSAT. Will you please tell how she can download the M.Tech. (VLSI Design & Embedded Systems) course syllabus of the Cochin University of Science and Technology (CUSAT).
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#2
1st June 2018, 02:32 PM
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Re: CUSAT M Tech VLSI Syllabus
Hi buddy here I am looking for CUSAT university M.Tech VLSI Technology And Design paper syllabus so would you plz let me know from where I can do download it ??
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#3
1st June 2018, 02:32 PM
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Re: CUSAT M Tech VLSI Syllabus
As you want here I am giving below CUSAT university VLSI Technology And Design paper syllabus which part of M.Tech (Electronics & Communication Engineering) program : ELE 3104 VLSI TECHNOLOGY AND DESIGN Basics of MOS, Bipolar and BiCMOS Device : MOS transistors, nMOS / CMOS device technology, Basic electrical properties of MOS transistor, V-I relationship, Threshold Voltage, MOS device as a resistor, MOS device as a capacitor, Transconductance, Conduction mechanisms in MOS device, Latch up in CMOS, Bipolar transistor structure and conduction, BiCMOS device, Latch up susceptibility in BiCMOS. MOS Circuit Design Processes and Subsystem Layout: MOS Layers, Stick Diagrams, Design Rules and Layout, General observations on the Design rules, Layout Diagrams, Basic Circuit concepts, Inverters. Architectural issues, Gate logic, Combinational logic, structured design processes, Clock sequential circuits, General considerations for bus lines, power dissipation, current limitations. Propagation delays and Scaling in MOSFET : Propagation Delays, Gate delay, Interconnect delay, Effects of sheet resistance and capacitances, Parasitics and interconnect impedances, Scaling factors for device parameters, Limitations of scaling, Constant field and constant voltage scaling, Effects on threshold voltage, Short channel effects. Basics of VLSI Device Fabrication : Basics of wafer fab processing, FEOL processing, Basics of oxidation / implantation / lithography / PVDs and CVDs, BEOL process, Interconnects, Process integration and in-line tests. High Frequency VLSI Devices and Sub-Micron Trends: Direct band gap semiconductors, Basics of GaAs material and structure for high frequency applications, GaAs based devices, MESFETs, RF-CMOS devices, FinFETS, Strained Si and Si-Ge |
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